· Completed process capability reviews on automated surface mount line including solder paste printer, pick & place equipment, and reflow oven which led to a Defects per Million Opportunities (DPMO) reduction from 3000 to 500.

· Supervised the evaluation, cost justification and installation of $900,000 of printed circuit board assembly equipment for both surface mount and through-hole assembly processes.

· Improved assembly process control by implementing routine thermal profiling of reflow, wave solder, and rework processes, which resulted in a 40% reduction in touch-up work.

· Responsible for plant layout of entire production area into manufacturing cells, improving product visibility, increasing process cycle time by 60%, and reducing work-in-process by 33%.

· Provide Design for Manufacturability (DFM) recommendations to customers’ PWB designs resulting in assembly cost and quality improvements.

· Facilitated 8 person surface mount continuous improvement team responsible for identifying critical process improvements through pareto and DPMO metrics

· Implemented surface mount assembly defect recording, tracking, and feedback system using SPC techniques, resulting in an increase in first pass SMT yield from 66% to 90%.

· Conducted process qualification for Ball Grid Array (BGA) assembly process, which to date has achieved a first pass yield rate greater than 99%.

· Interface with customers to review new and existing designs for manufacturing issues and concerns on printed circuit assemblies

· Evaluate and introduce new technology

· Publish a formal design review to customer following new product build

· Perform pre-engineering duties including ordering stencils, deciding build technology, coding parts, generating DFM

· Following NPI build through the build process to evaluate efficiency

· Team leader in introducing UniCam to facility for program and process generation

· Team leader in developing and publishing design for manufacturing guidelines to be used by internal and external customers

· Team leader in researching and developing reliable process for assembling micro BGA’s components to PCB’s.

· Fuji, Universal, and Panasonic pick and place

· Unicam, Fujicam, LabView, Visual Basic